《电子封装陶瓷基片材料的研究进展》.pdfVIP

20 7 2010 7 Vol.20 No.7 The Chinese Journal of Nonferrous Metals July 2010 1004-0609(2010)07-1365-10 ( 410083) Al O AlN BeO SiC Si N 2 3 3 4 AlN Al O AlN BeO SiC Si N 2 3 3 4 TN305.94 A Research progress in ceramic substrate material for electronic packaging LI Ting-ting, PENG Chao-qun, WANG Ri-chu, WANG Xiao-feng, LIU Bing (School of Materials Science and Engineering, Central South University, Changsha 410083, China) Abstract: The elemental requirements for electronic packaging substrate materials are summarized. The characteristics of alumina, aluminum nitride, beryllium, silicon carbide, silicon nitride ceramics substrates used for electronic packaging and the recent research achievements of the electronic packaging ceramic substrate materials are discussed, the aluminum nitride has the best comprehensive properties among them. The advantages and disadvantages of tape calendaring, tape casting, gel-casting technologies for forming thin ceramics are analyzed, gel-casting in which has relatively strong applicability. The development trends of ceramic substrate materials and forming technologies are pointed out. Key words: electronic packaging materials; alumina ceramics; AlN ceramics; beryllium ceramics; silicon carbide ceramics; silicon nitride ceramics; tape casting; gel-casting 1) 2)