全新DLCthkbyESCAAES.pptVIP

DLC thickness measurement by ESCA AES Contents Background ESCA measurement AES measurement Test I Test II Further actions Background In SAE, there are a number of instruments, namely, ESCA, AES, AFM, etc., can measure ultra-thin DLC thickness The purpose of this study is to correlate the DLC thickness measurement by ESCA, AES AFM ESCA (by VPDE) ESCA (by VPDE) ESCA (by VPDE) ESCA (by VPDE) AES (by SA Lab.) AES (Survey) By testing a standard sample (calibrated by AFM) DLC thickness = 39.1? Sputtering time = 2.17 min Therefore Sample list of test I DLC film has been deposited on TF1000 row bars The expected thickness are as follows, (Si/DLC, unit: ?) 25/5, 25/10, 25/20, 25/30, 25/35, 25/40, 25/45, 25/50, 25/55 Results of test I Sample list of test II DLC film, without Si seed layer has been deposited on Si chip with photo-resist to correlated with AFM The expected thickness are as follows, (unit: ?) 5, 10, 20, 30, 35, 40, 45, 50 Results of test II Results of test II Results A good linear relation are established between DLC thickness measuring parameters for ESCA AES Good correlation for DLC thickness 15 - 50 ? is found for ESCA AES Further action Collaborate with VPIE to use ESCA AFM for DLC production monitoring * TDK/SAE CONFIDENTIAL MSL dept. - SA Lab. / VPDE / WEE Prepared by : Lai Kwong Yu Date : September 25, 2001 SAE Magnetics (H.K.) Ltd. TDK/SAE CONFIDENTIAL TDK/SAE CONFIDENTIAL TDK/SAE CONFIDENTIAL Calculation Algorithm 3 layer model (for row bar) d: DLC thickness a,b,J,?: parameters TDK/SAE CONFIDENTIAL Calculation Algorithm 3 layer model (for row bar) d’ : Si thickness B,?: parameters TDK/SAE CONFIDENTIAL Calculation Algorithm 2 layer model or a,b,c,?: parameters for Si chip for AlTiC TDK/SAE CONFIDENTIAL Typical ESCA spectra for DLC measurement Si substrate TDK/SAE CONFIDENTIAL Calculation Algorithm 3 layer model - total thickness of DLC Si is less than AES sampling depth 2 layer model - total thickness is