ECS 2013 A Comprehensive Study of Thermal Stability on Microstructure and Residual Stress for ALD HfZrO2 Films at 28nm HKMG CMOS Applications外文翻译.pdfVIP

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ECS 2013 A Comprehensive Study of Thermal Stability on Microstructure and Residual Stress for ALD HfZrO2 Films at 28nm HKMG CMOS Applications外文翻译.pdf

ECS Transactions, 58 (10) 299-306 (2013) 10.1149/05810.0299ecst ©The Electrochemical Society A Comprehensive Study of Thermal Stability on Microstructure and Residual Stress for ALD HfZrO2 Films at 28nm HKMG CMOS Applications C. K. Chiang, J. C. Chang, C. C. Chien, C. L. Yang, J. Y. Wu United Microelectronics Corporation, Tainan Science Park, Sinshih Dist., Tainan City

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