第十四章IO环设计_1摘要.pptVIP

第十四章 I/O设计及封装 （一） Outlines Basic structure of I/O cells Noise Cancellation ESD Protection Scheme I/O ring design Package Selection Outlines Basic structure of I/O cells Noise Cancellation ESD Protection Scheme I/O ring design Package Selection Performance with Die, Package, Board Three main killers of performance Power supply noise Reference clock noise Signal integrity These challenges are relevant at the die, package, board and system level These challenges have existed at lower speeds but dramatically increase in high speeds I/O Cell I/O Cell – Connect Core to Package Supply