以推論多項式網路預測晶圓表面不均勻度.PDF

桃園創新學報第三十二期 以推論多項式網路預測晶圓表面不均勻度 ────────────────────────────────────────── 以推論多項式網路預測晶圓表面不均勻度 1 1 2 1 黃彥志 郭俊廷 林有鎰 邱傳聖 1. 2. 元智大學機械工程學系 德霖技術學院機械工程學系 摘 要 本研究首先建立化學機械研磨二維軸對稱準靜態邊界元素模式，模擬晶圓 負載、研磨墊厚度及研磨墊之楊氏係數等參數對晶圓表面 von Mises 應力分佈 的影響。藉由改變各項參數，獲得 von Mises 應力改變之趨勢，結果顯示上述 趨勢與表面不均勻度之趨勢一致。比較由推論多項式網路訓練所得的應力分佈 及不均勻度估計值和實驗量測值，證明本文所建立的推論式網路預測模式應用 在晶圓表面不均勻度之研究上，具有一定的可行性。 關鍵字：化學機械研磨、推論多項式 網路、邊界元素、不均勻度 E-mail ：s995032@ Tel ：+886-3-4638800轉 2466轉 3311 73 桃園創新學報第三十二期 以推論多項式網路預測晶圓表面不均勻度 ────────────────────────────────────────── Prediction of nonuniformity on wafer surface using an abductive polynomial network Yen-Chih Huang1 Jyun-Ting Guo1 Yeou-Yih Lin2 Chuan-Sheng Chiou1 1Institute of Mechanical Engineering, Yuan Ze University. 2Institute of Mechanical Engineering, De Lin Institute of Technology. Abstract In this paper, a two dimensional axisymmetric quasic-static boundary element model for the chemical mechanical polishing (CMP for short) process was established. In this model, the load forms are carrier load, the thickness and Young’s modulus of pad. Effect of above parameters on von Mises stress and nonuniformity of wafer were investigated. The trend of the distribution of von Mises stress and nonuniformity of wafer matched well. The comparison between the estimated value from the abductive polynomial network training and the measured value proves that the developed network model possesses a certain degree of feasibility in the study of the nonuniformity o