MEMS复习攻略创新.docx

 PAGE \* MERGEFORMAT 15 特此感谢： 卓著、王明斗、兰天翔、唐小涛、周孝吉对本攻略的贡献。 董建鹏 2015/1/14 简述： 1、只是包含MEMS中需要自己总结的内容比较多的知识（除ppt6-7一些琐碎的概念，其他章节部分需要总结的基本已涵盖）。 2、时间仓促，做得可能不是很完善请谅解。 3、英语水平有限，单词语法错误自己改正 4、若有错误或没有涉及到的还望大家补充改正（英语）。 5、.祝各位取得好成绩！！！！！ difference: MEMS is a process technology used to create tiny integrated devices or systems that combine mechanical and electrical components. NEMS is a great development of MEMS. Content: (1) Scale size (2) Material (3) Process technology MEMSNEMSBasic materialSiliconCarbonMEMS NEMS Scale Size 1.Component: 1um~100um 2.Device : 0.1mm~1mm  1nm~100nm  (4) Principle (5) Feature (6) Application (自己酌情删减) MEMSNEMSProcess technology1.Miniaturized machine tool 2.Wet etching 3.Dryetching(RIE AND DRIE ) 4.Electro discharge machining(EDM): 5.LIGA(X-ray)1.AFM/STM induced oxidation method 2.Electron-beam lithography(20nm) 3.Atom or molecule assembly technique MEMSNEMSprinciple1.High power density (Micro-scale effect) 2.Large surface area to volume ratio makes surface effects dominant over volume effect. 3.Large thermal conductivity 1.Nano-scale effect 2.Quantum effect 3.Interfacial effect  MEMS NEMS feature1.Two dimension or quasi- Three dimension Structure 2.High precision 2-D control 3.Integration mass production 4.low power and less inertia 1.Ultra-small dimension 2.Ultra-high frequency Response(more than 100MHZ) 3.Ultro-low power  MEMSNEMSApplication1.Targeted drug delivery system 2.Miniature robot system 1.Biological motor 2.Ultra-high frequency RF resonator  扰动执行器的组成及其运动过程： Scratch Drive Actuator (SDA) （1）component：plate bushing insulator（绝缘体） substrate (2) process Applied voltage bends SDA downward When released, SDA returns to original shape Reapplying voltage causes SDA to move a distance ’dx’ Pattern transfer （1）thin film on substrate Silicon dioxide is deposited as structural or sacrificial on the substrate by PVD or CVD. （2）photoresist coated