封装专用英语词汇.docVIP

常见封装形式简介 DIP = Dual Inline Package = 双列直插封装 HDIP = Dual Inline Package with Heat Sink = 带散热片的双列直插封装 SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装 SIP = Single Inline Package = 单列直插封装 HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插封装 SOP = Small Outline Package = 小外形封装 HSOP = Small Outline Package with Heat Sink = 带散热片的小外形封装 eSOP = Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装 SSOP = Shrink Small Outline Package = 紧缩型小外形封装 TSSOP = Thin Shrink Small Outline Package = 薄体紧缩型小外形封装 TQPF = Thin Profile Quad