焊线培训讲述.pptVIP

1、焊接的基本理论2、焊接的操作方法3、焊锡点工艺标准4、焊点外观不良5、360度全周焊6、安全注意事项 The end 27 27 27 27 Mechanical Strength Connector must withstand physical requirements of intended application Termination should be almost as strong as the wire itself (see chart 6132-3; “Tensile Strength of Wire and Terminations”) 11 WHAT IS CMA? Wiring sizing methods rely on Circular Mil Area (CMA). CMA is the cross sectional area of the wire measured in circular mils (thousandths of an inch). The cross sectional area determines the current carrying capability of a wire. To determine CMA for solid wire, square the diameter as measured in mils (D2). For stranded wire, square the diameter of an individual strand (d2) and multiply by the number of strands (N). 11 WHAT IS CMA? Wiring sizing methods rely on Circular Mil Area (CMA). CMA is the cross sectional area of the wire measured in circular mils (thousandths of an inch). The cross sectional area determines the current carrying capability of a wire. To determine CMA for solid wire, square the diameter as measured in mils (D2). For stranded wire, square the diameter of an individual strand (d2) and multiply by the number of strands (N). 焊接接点外观不良 原因：锡点过大。与较小的接头焊接时，所用锡丝规格太粗或烙铁咀太大；或焊接时，針与針之导体搭接方法错误。 锡点过大 焊接外观 Pin针间距太密：焊锡呈超饱和状态，锡点面积完全超出 焊接导体面积5/4， 焊接接点外观不良 原因：烙铁咀烫破绝缘皮；或 手指甲太长，焊线时刺破绝缘皮；或其它利器刮伤。 焊接外观 芯线破皮：靠近焊接点大约2CM处的绝缘皮破损，露出导体。 芯线破皮 焊接接点外观不良 焊接外观 铜丝未完全埋入焊点：有一根以上的铜丝完全没有焊接上 铜丝未完全埋入焊点 导体外露太长 导体外露太长：铜丝外露超过10MM为严重缺点；铜丝外露为5~10MM为主要缺点；铜丝外露长度超过与相邻导体裸露导体部分距离的二分之一小于5MM大于安全距离为轻微缺点。 其它外观不良 焊接外观 焊点脏 绞线 焊锡裂 焊锡珠 焊点不光滑 焊接接点外观不良 烫伤绝缘皮: 芯线绝缘皮熔化混合在焊锡点内,锡点表面不光滑且有烧焦物,且芯线绝缘皮与锡点粘连不见导体铜丝. 焊接外观 原因：芯线开剥长度太短,或焊接时导体放置不当,或锋铁放置时烙铁咀与焊接面之角度太小. 燙伤绝缘皮 插接外观示图 焊接外观 芯线导体与杯筒倾斜 理想的焊接 杯筒上粘有锡尖 锡少 环焊之前的准备工作由处理工位完成 360度全周焊 1、如果内模未完全包覆芯线，需用美纹胶纸包住內模，以防止铜箔和芯线短路。 2、沿著插头铁壳边缘包铜箔一圈半到两圈(使铜箔与铁壳紧密结合，无间隙)，且包裹的铜箔需光滑，平整。(铜箔需完全包覆内模，从任何角度察看，都不可