玻璃上打孔.docVIP

Chip on a chip Miniaturisation for chemistry, physics, biology and bioengineering Chips Tips: Rapid, inexpensive and stress free drilling in glass substrates or thermally bonded glass chips using electrochemical spark erosion method 25 January 2011 Arun AroraKIST Europe, Korea Institute of Science and Technology, Campus E7.1, 66123 Saarbrücken, Germany Background An electrochemical spark erosion method is presented to drill holes in glass substrates or thermally bonded glass chips. Shohi and co-workers [1] reported this method in 1990. We have modified the method by using? a Pt wire 0.5 mm diameter anode instead of a steel needle cathode as a drilling needle and 50 V instead of 35 V was applied from a variable unregulated dc power supply to produce a constant spark in 8 M sodium hydroxide solution. When a steel needle cathode was used as reported in reference Shohis method, a large amount of brown precipitate was formed, which entered into the channel and created blocks.?Figure 1 shows a schematic diagram of the complete process and figure 2 is a photo of the setup showing the process in operation. Figure 1: Electro chemical spark erosion method of drilling holes in a thermally bonded glass device Figure 2: Photo of the electro chemical spark erosion method for drilling holes in a thermally bonded glass device Why is this useful? The conventional methods to drill holes in glass include laser ablation or powder blasting. Both methods require expensive setup and trained staff therefore these methods are expensive.? The dentist drill also used to drill holes in bonded glass devices which can cause stress to the glass or can damage the channel walls. Sometimes glass particles can also clog the channel. A simple method for drilling access hole in a glass substrate or a thermally bonded glass chip is presented. What do I need? Pt wire 0.5 mm diameter Sodium Hydroxide solution 8M Caution Variable DC Power supply 100 V Petri dish What do I do? Fixed a pt