纳米压痕法测试SAC0307-xCe循环加载-卸载下的力学行为研究.docVIP

纳米压痕法测试SAC0307-Ce循环加载-卸载下的力学行为研究在众多的无铅钎料系列中Sn-Ag-Cu系列钎料有良好的延展润湿性，光亮性能Sn-Ag-Cu系列钎料合金替代Sn-Pb共晶钎料的。Sn-Ag-Cu钎料添加稀土元素的研究，但是在循环加载条件下对其添加稀土元素Ce的研究相对较少。本文以Sn-0.3Ag-0.7Cu无铅钎料为对象，研究。研究结果：Sn-0.3Ag-0.7Cu钎料的强度硬度等力学性能获得改善。在Ce含量为0.07%时，钎料焊点的力学性能最优，而随着Ce含量的增加或者是降低都将会导致钎料强度和硬度的下降，弹性模量下降，脆性增加，从而导致综合力学性能下降；BGA 焊点在保载阶段发生蠕变，且随着保载时间的增加，蠕变位移不断增大，而增加幅度变小。 关键词：BGA焊点；循环加载-卸载力学行为Nano indentation method test SAC0307 - xCe under cyclic loading, unloading force for research Abstract At present, the main point of the electronics industry is the miniaturization electronics and the high integration development. But, it can be bring more and more problems and challenges. In the process of delivery and using, the miniaturization electronics would be destroyed easily because of the random vibration and drop impact. It makes people to increase the security of electronics. So, it is more significant for the study of BGA Solder Joints. In the different series of Lead-free solder, the low Ag series of Sn-Ag-cu has became the main material to instead of Sn-Pb Eutectic solder because of its good ductility, wettability, luminance and mechanical properties. If add less rare-earth element into it, it will improve elasticity modulus, creep properties, dynamics of low Ag solder and so on. Even though some predecessors have been studied the test of Sn-Ag-Cu add rare-earth element, there are less experiments that add the rare-earth element of Ce under cydic loading. The exam object of the paper is Lead-free solder that Sn-0.3Ag-0.7Cu-xCe (where the x is 0, 0.03%, 0.05%, 0.07%, 0.10% respectively). The purpose of the test is that study the different influences of BGA welding spot Nano mechanical behavior in the different Ce content and hold time. The research results show that the intensity and hardness of low Ag Sn-0.3Ag0.7Cu and other mechanical property can be improved after add the rare-earth element Ce. When the Ce content was 0.07%, the mechanical properties of the solder joint is the best. With the Ce cont