UMC Foundry service flow.pptVIP

Outline The Family of UMC Global Foundry Factory Foundry Production Flow Order + Production Plan Front End Production Back End Production Shipping Customer Service 1. The Family of UMC Global Foundry Factory The Overview of Major Production Management System for the Front End Process 4.4. A Real-Time Lot Management System - MES 4.5. The System Application in Notes 4.6. Daily Production Management - AMAS 4.7. Engineering Data Analysis - UEDA 4.7 Engineering Data Analysis - UEDA 4.8 Wafer Inspection before the W/O WAT test criteria: Electrical, Resistance Integrity Measurement Test Site : 5 Sites, B, L, C, R, T PCM SPEC : SPEC High/Low PCM: Process Characteristic Monitor Pass/Fail Rule : 1/2 (Test Sites) Fail -- Scrap OQA = refer to appendix 5 目視及上機檢驗(Visual inspection) 列印 Bar Code(Printing Bar Code) 準備出貨文件(Prepare the ship-out document) 打包分類(Packing and Classification) 出貨至碼頭(Ship to the dock) 4.9 What is a reasonable WIP in Fab? What is WIP(在製品)? Work(ex. Lot) in Process before Ship Out. The reasonable Stadnard WIP is based on: Wafer Out - More WIP, more W/O Cycle Time - More WIP, longer the C/T Layer - More layers, more WIP Yield - Less Yield rate, more WIP 4.10 What are the Fab Managers concerning most? Profit and Margin Rate Target/Actual Wafer Out Product Cycle Time Product Yield(良率) CLIP(Confirmed Line Item Performance to Customer): 客戶交期達成率 Others: Product/Process abnormal Handling Turn Over Rate(週轉率) Standard/Actual WIP WIP Distribution Daily Wafer Start (每日投片量) Line Balance Capacity Allocation(產能調配) Target/Actual Daily Move Equipment Status(機況) including Up/Down, Constrains(機限), Bottleneck Prevention(瓶頸預防) 4.4.5 Lot Special Processing in MES Lot Customization(材料特殊化): update PU, Recipe or Reticle for future flow Update Lot Job(修改材料工作單): update PU, Recipe or Reticle for current step 4.5 The System Application in Notes Order In Shipping W/O W/S Production Plan Work In Process A C D F E Product Spec Wafer Start Sheet Mask Tracking 晶片下線計劃表 Product Wafer Ma