低k介质的电特性.pptVIP

Low-k Dielectrics: Materials and Process Technology Rebeca C. Diaz EE 518, Penn State Instructor: Dr. J. Ruzyllo April 13, 2006 Outline Motivation for low-k dielectrics Required properties of low-k dielectrics Proposed materials Most promising materials CVD vs. Spin-on techniques Conclusion Why Low-k Dielectrics? Reduce RC constant without reducing size R metal interconnect minimized with Cu C dielectric need low-k Why Low-k Dielectrics?2 Required Properties of Low-k Dielectrics2 Proposed Materials2,3 Inorganic/organic Hybrid: MSQ (k = 2.0)2 HOSP (Honeywell) “Car