可焊性wetting balance.ppt

Wetting Balance Instrument(MUST System-II) It can be used for study of below: Printed circuit boards Surface treatment metals Fluxes Solder alloys Cleansers The Wetting Balance_Must System – II The Wetting Balance_Must System – II Solderability of Metals The Wetting Balance_Must System – II Solderability on different surface --- Solder on Oxidised21 Copper The Wetting Balance_Must System – II Solderability on different surface --- Solder on Clean Copper The Wetting Balance_Must System – II Wetting Forces Formula The Wetting Balance_Must System – II Wetting Forces Formula: The Wetting Balance_Must System – II Wetting Process The Wetting Balance_Must System – II Wetting Process The Wetting Balance_Must System – II Wetting Curve The Wetting Balance_Must System – II Wetting Curve The Wetting Balance_Must System – II Wetting Angle Analysis The Wetting Balance_Must System – II Quantitative Measurement By ST60 The Wetting Balance_Must System – II The Compliant of ST60 The Wetting Balance_Must System – II Measurement Application For wetting to occur,the contact angle Theta Be less than 90 degree. rlv = surface tension of Flux/Molten solder( ? 0.4 mN/mm) c = specimen perimeter (mm) θ = contact angle g = gravitational acceleration (9.81m/s2) ? = solder density(8 mg/mm3) v = specimen immersed volume (mm3) Sample reach the surface of the solder bath Sample at end of immersion depth – Achimede push Forces at Equilibrium Maximum Wetting force Sample lift out of the solder bath Sample is out of the solder bath θis reckoned directly from the force (F) measured. F + ? .v.g COSθ= ---------------- rlv.c Note: The wetting contact angle applies only to liquid solder. The angle θis fully representative of the quality of wetting(or solderability). 0o??30o very good wetting 30o??40o good wetting 40o??55o acceptable wetting ??70o very poor wetting The result are expressed in quantitative un