PCB术语中英文对照表.docxVIP

Adhesion????????附着力 Annular?Ring????????孔环 AOI（automatic?optical?inspection）????????自动光学检测 AQL（acceptable?quality?level）????????可接受的质量等级 Bsup2;it(buried?bump?interconnection?technology)????????埋入凸块焊点互连技术 BBH(buried?blind?hole)????????埋盲孔 BGA(ball?grid?array)????????球栅阵列 Blister????????起泡 Board?Edges????????板边 Burr????????毛头/毛刺 BUM(Build-up?multilayer)????????积层式多层板 BVH（buried/blind?via?hole）埋/盲导通孔 CAD(computer?aided?design)????????计算机辅助设计 CAM(computer?aided?manufacturing)????????计算机辅助制造 Carbon?oil????????碳油 CEM(composite?epoxy?material)????????环氧树脂复合板材 chamfer????????倒角 Characteristic?impedance????????特性阻抗 CNC（computerized?numerical?control）计算机化数字控制 Conductor?Crack????????导体破裂 Conductor?Spacing????????导线间距 connector????????连接器 Copper?foil????????铜箔（皮） Crazing????????微裂纹(白斑) Delamination????????分层 Dewetting????????半润湿(缩锡) DFM（design?for?manufacturing）可制造性设计 DIP(dual?in-line?package)????????双列直插式组件 Dk（dielectric?constant）介电常数 DRC(design?rule?checking)????????设计规则检查 drawing????????图纸 ECN(engineering?change?notice)????????工程更改通知 ECO(engineering?change?order)????????工程更改指令 E?glass????????电子级玻璃 entek????????OSP处理 Epoxy?resin????????环氧树脂 ESD(electrostatic?discharge)????????静电释放 Etched?Marking????????蚀刻标记 Flatness????????翘曲度 Foreign?Inclusion????????外来夹杂物 Flame?resistant????????阻燃性 FR-2(flame-retardant?2) 耐燃酚醛纸基板 FR-3(flame-retardant?3)????????耐燃环氧纸基板 FR-4(flame-retardant?4)????????耐燃环氧玻璃布基板 FR-5(flame-retardant?5)????????耐燃多功能环氧玻璃布基板 ground????????地面（层） Haloing????????晕圈 HDI(high?density?interconnection)????????高密度互连技术 HASL(hot?air?solder?leveling)????????热风焊料整平（整平） IC(integrated?circuits)????????集成电路 Ink?Stamped?Marking????????盖印标记 Insulation?resistance????????绝缘电阻 Ion?cleanliness????????离子清洁度 IPC(the?institute?for?interconnecting?and?packaging?of?electronic?circuits)????????印制电路互连与封装协会 ISO(International?organization?for?standardization)????????国际标准化组织 Laminate?Voids????????压合空洞 laser????????激光 LDI(laser?direct?imaging)????????激光直接成像 legend????????文字标记、符号 Lifted?Lands????