1Mar(Substrate Crack Issue 8D Report (NXPowerLite)Rev 2.pptVIP

February 2004 HP corporate presentation tutorial - XP October 2003 Presentation Title Copyright ? 2003 HP corporate presentation. All rights reserved. 2010 ? ASE Material. All rights reserved. Substrate Crack Issue 8D Report Prepare by: ASESHMTL Team Update date: 2010/3/10 D1 Team Member When : Highlighted at 1-March-2010 Where: Detected by IQC from STM_ Shenzhen What : Defect Mode: Scrap method of substrate crack/damage error Impact Part Number: `TFBGA AFOP . Product Spec: scrap the strip for customer Actual : scrap the unit Problem Description Defect Photo Scrap the unit Problem Verification Spec: Scrap the strip for customer Actual : scrap the unit D2 Problem Description Check ASE stock and hold the lot in ASE stock for sorting. Owner: SH Chang Due date: 2010/3/2 Status: done Result: total 11lots in ASE stock, the lots have been hold and are waiting for rescreened. Lot list please refer below table 2. In the FVI/AVI and OQC team, inform them put out the strips that was impact by substrate crack issue. Owner: SH Chang Due date:2010/3/1 Status: Done D3 Containment Action 3. Tighten OQC sampling size for substrate crack issue for STM AFOP Product for one month. Owner: Lisa Tang Due date: 2010/3/2 Status: Open Result: sample size from 800pcs/lot to 1250pcs /lot D3 Containment Action Defect Mode analysis Defect sample analysis by visual inspection, below photo, it is the major crack issue in our process. Per defect photos, the crack impact on a smaller area, we suspect that was caused by pressure force. but not like bending Refer below defect photos from our process, substrate crack on the panels, this issue occur after S/M printing process. D4 Root Cause Analysis Impact area Defect from customer Pattern process S/M process Ni/Au process Routing process FVI Water cleaning PKG Substrate crack issue monitor in our process As below flow, we check our process and monitor substrate crack inspection data. After process monitor, we found s