PCB通孔导通效分析.docVIP

PCB通孔导通失效分析 背景资料 PCBA上BGA部位上H6点对地绝缘阻抗降低。 样品：6 pcs（其中失效样品2pcs，同批未失效样品2pcs，PCB裸板2pcs） 客户要求：分析绝缘阻抗降低部位及原因 横向剖切分析 横向剖切分析 部位 部位说明 阻值测试结果 1 芯片焊盘处 有阻值 2 芯片与BGA焊点结合处 有阻值 3 BGA焊点中部 有阻值 4 BGA焊点与PCB焊盘结合处 有阻值 5 PCB内部 有阻值 6 PCB内部 有阻值 7 PCB内部 有阻值 8 PCB内部 ∞ 纵向剖切分析 对PCBA上U1元件H6点对应通孔及对地点通孔进行切片。 4.纵向剖切分析 使用金相显微镜的暗场方式对通孔间部位进行观察，发现H6点对应通孔与接地点通孔间存在导电阳极细丝（CAF, Conductive Anodic Filament）存在。 5. 结论 通过横向显微抛切分析结果得知失效部位位于PCB板内。 通过纵向显微抛切分析，发现H6点对应通孔与接地点通孔间存在导电阳 极细丝（CAF, Conductive Anodic Filament），是导致H6点与接地点间产生阻值的直接原因。 CAF产生的原因可能为过度的灯芯加上孔与孔相距太近使得板材间的绝缘品质下降。通过分析发现失效部位通孔间距为350μm左右，而其相邻 部位通孔间距为550μm左右。 implementation of corrective tasks for the new problems found in a timely manner into the special rectification and rectification category. In-depth summary of good practices and good experience in educational practice, good around the typical, continue to promote the rectification, to prevent repeated rebound, use of the results of the activities, timely organization look back again. The theoretical results, continuously consolidate and deepen and expand educational practice to achieve the system results, practical results. Three, the main problems and rectification measures focus on rectification goals, determined to honor the commitment rectification measures to build long-term mechanism style construction bureau Party, improve the ideological style The construction and working level, according to the list of issues to sort it out, with overall requirements to carry out the mass line of educational activities, focus on the implementation of the rectification, enhance team ability to discover and solve their own problems, focus on building a political firm, pioneering and innovative, wholeheartedly for the people, strive for unity, harmony, strong collective leadership a honest and clean. there lack of global awareness and innovation problem in carrying out the democratic centralism of the party. The party will discuss the main points of the 2014 Bureau of s