5光刻与刻蚀工艺重点.ppt

PLASMA ETCH Etch dielectric Etch single crystal silicon Etch polysilicon Etch metal Dielectric Etch Etch oxide – Doped and undoped silicate glass – Contact PSG or BPSG – Via USG, FSG or low-k dielectric Etch nitride – STI（浅槽隔离） – Bonding pad（压焊点） Dielectric Etch Fluorine chemistry 4F + SiO2 ? SiF4 +2O CF4 is commonly used as fluorine source NF3 and SF6 have also been used 加入O2以提高刻蚀选择比，如图所示。 Single Crystal Silicon Etch Small amount O2 for sidewall passivation A little NF3 for preventing black silicon Polysilicon Etch Gates and local interconnections – Most critical etch process, smalle