IC设备制造概述.ppt

先进制造技术 半导体制造装备 半导体制造装备概述 芯片制造（前道） 单晶硅拉制、切片、表面处理、光刻、减薄、划片 芯片封装（后道） 测试、 滴胶、Die bonding、Wire bonding、压模 Advantage Fully automatic machines have been developed for volume production. Bonding parameters can be precisely controlled; mechanical properties of wires can be highly reproduced. Bonding speed can reach 100-125 ms per each wire interconnection (two welds and a wire loop). Most reliability problems can be eliminated with properly controlled and much improved tools (capillaries and wedges) and processes. Specific bonding tools and wires can be selected by packaging engineers to