Flipchip制造流程11.pptVIP

* 1.Metal bump 金屬凸塊-C4 process(IBM) 2. Tape-Automated bonding 捲帶接合-ACF process 3. Anisotropic conductive adhesives 異方向性導電膠 -ACP process 4.Polymer bump 高分子凸塊 - C4 process 5.Stud bump. 打線成球 - ACP process(Matsushita) Flip Chip conductive method - connect to Substrate/PCB C4: controlled collapse chip connection ACF: anisotropic conductive film ACP(ACA): anisotropic conductive Adhesive paste Kingbond Training Course Kingbond Training Course Various flip chip technologies PS: WIT ( Wire interconnect technology) TAB(Tape- automated bonding) Kingbond Training Course Various flip chip technologi