半导体制备技术简介CH14.ppt

Hong Xiao, Ph. D. www2.austin.cc.tx.us/HongXiao/Book.htm Chapter 14CMOS Processes Objectives List the major process technology changes from the 1980 to the 1990s Explain the differences between copper metallization and traditional metallization From 1960s to 1970s 1960s PMOS Diffusion Metal gate 1980’s Technology LCD replacing LED as indicators for electronic watches and calculators CMOS IC replacing NMOS IC for lower power consumption Minimum feature size: from 3 mm to 0.8 mm Wafer size: 100 mm (4 in) to 150 mm (6 in) 1980’s CMOS Technology LOCOS PSG and reflow Evaporator for metal deposit