3D封装技术的未来..docVIP

试议3D封装到来时的机遇与挑战 1111摘要：本文揭示了在摩尔定律即将失效的大背景下，电子信息产业的开发思维、生产方式将发生一系列变革；较详尽地阐述了3D封装将是电子产业发展的必然趋势；反映了检测手段的提高是3D封装前面临的主要难题。分析了我国信息电子产业在所面临的机遇和挑战。 关键词：摩尔定律 3D封装机遇与挑战Discussion on the opportunities and challenges of the 3D package’s coming Liu Bin, Yan Shixin Suzhou Detian Optical Technology Co., Ltd. Abstract: Against the background of Moore’s law will lose effectiveness，a variety of reformation will the development and production mode of electronics and information industry; 3D-TSV will be the inexorable trend of the electronic industry, and the improvement of detection level is the main problem o