bt137 BT137S-600G,118;BT137S-600,118;BT137S-600F,118;BT137S-800F,118;中文规格书,Datasheet资料.doc
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bt137 BT137S-600G,118;BT137S-600,118;BT137S-600F,118;BT137S-800F,118;中文规格书,Datasheet资料
bt137 BT137S-600G,118;BT137S-600,118;BT137S-600F,118;BT137S-800F,118;中文规格书,Datasheet资料
Philips SemiconductorsProduct specification
Triacs
GENERAL DESCRIPTION
Passivatedtriacsinaplasticenvelope,suitableforsurfacemounting,intendedforuseinapplicationsrequiringhighbidirectionaltransientandblockingvoltagecapabilityandhighthermalcyclingperformance.Typicalapplicationsincludemotorcontrol,industrialanddomesticlighting,heatingandstaticswitching.
BT137S series
QUICK REFERENCE DATA
SYMBOL
PARAMETER
BT137S-BT137S-BT137S-Repetitive peak off-statevoltages
RMS on-state current
Non-repetitive peak on-statecurrent
MAX.600600F600G600865
MAX.800800F800G800865
UNIT
VDRMIT(RMS)ITSM
VAA
PINNING - SOT428
PIN CONFIGURATION
SYMBOL
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).SYMBOLVDRMIT(RMS)ITSM
PARAMETER
Repetitive peak off-statevoltages
RMS on-state currentNon-repetitive peakon-state currentI2t for fusing
Repetitive rate of rise ofon-state current aftertriggering
full sine wave; Tmb ≤ 102 ?C
full sine wave; Tj = 25 ?C prior tosurget = 20 mst = 16.7 mst = 10 ms
ITM = 12 A; IG = 0.2 A;dIG/dt = 0.2 A/μs
T2+ G+T2+ G-T2- G-T2- G+CONDITIONS
MIN.--------------40--6006001
8657121505050102550.5150125MAX.
-800800
UNITVAAAA2sA/μsA/μsA/μsA/μsAVWW?C?C
I2tdIT/dt
IGMVGMPGMPG(AV)TstgTj
Peak gate currentPeak gate voltagePeak gate powerAverage gate powerStorage temperatureOperating junctiontemperature
over any 20 ms period
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac mayswitch to the on-state. The rate of rise of current should not exceed 6 A/祍.June 2001
/
1Rev 1.400
Philips SemiconductorsProduct specification
Triacs
THERMAL RESISTANCES
SYMBOLRth j-mbRth j-a
PARAMETER
CONDITION S
MIN.---
BT137S series
TYP.--75
MAX.2.02.4-
UNITK/WK/WK/W
Thermal resistancefull cyclejunction to mounting basehalf cycleThermal resistancepcb (FR4) mounted; footprint as in Fig.14junction to ambient
STATIC CHARACTERISTICS
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