ProductPresentation-上海美高森美半导体有限公司.pptVIP

Feb 2011 * Quality System ISO 9001:2008 ISO 14001:2004 Feb 2011 * Quality System RoHS Compliance REACH Compliance UL Approved Feb 2011 * Thank You Shanghai Microsemi Semiconductor Co., Ltd. 203 Shen Nan Road, Shanghai, 201108, PRC Website: Email: Sales@ Sales : 0086 - 21 - 6489 - 6650 * * SMSC Overview Shanghai SMSC Overview Feb 2011 * Shanghai Microsemi Semiconductor Co., Ltd. Feb 2011 * Company Profile Located at Xin Zhuang, Shanghai, China Established in September 1995 100% owned by Microsemi Corp in Dec 2007 4” Wafer Fab with monthly output 60K pcs, 80% utilization rate Feb 2011 * Products Portfolio GPP Chips Finished Goods Feb 2011 * Finish Goods Diode GPP Diode Modules Bridges 3-Phase Rectifier Bridges High Voltage Stack Diode Single-Phase Rectifier Bridges Diode Modules Rectifier+SCR Modules 3-Phase Rectifier Modules FRED Modules SCR Modules Products Tree Feb 2011 * Microsemi Shanghai ’s Technology Advantages Feb 2011 * Passivation techniques Star Die Construction Process Diffused wafer (Open Junction) Diffused wafer + Silicone rubber protection Grooves etching + Glass layer on etched grooves Grooves etching + SIPOS + Glass layer on etched grooves Quality rating Low end Low quality Low end Low quality Medium quality Better than medium quality P+ N N+ P + N + P+ N N+ P+ N N+ N N+ P+ Feb 2011 * Microsemi’s 5-Star Passivation P+ N N+ Silicon nitride layer = Silicon Nitride Glass passivation Microsemi uses the process for all hi-rel discrete devices Process : Grooves etching + Silicon Nitride + glass layer on etched grooves Quality rating: Highest quality process Feb 2011 * Advantages of SMSC’s GPP chips Technology coming from Microsemi Corp’s Hi-Rel processing Unique multilayer passivation ensure excellent high temperature characteristics and passing 200C HTRB test Die size from 0.050” Sq to 0.672” Hex LPCVD : Low Pressure Chemic