Ti3SiC2塊儿状陶瓷的微观组织及其耐损坏机制论文翻译.doc

Microstructure and mechanism of damage tolerance for Ti3SiC2 bulk块儿状 ceramics Ti3SiC2块儿状陶瓷的微观组织及其耐损坏机制 Abstract Titanium silicon carbide (Ti3SiC2) is a damage tolerance material that is expected to be used in a number of high temperature applications. Ti3SiC2陶瓷是在高温应用中使用的损伤容限材料。 In this work, the microstructure and damage tolerance mechanism of Ti3SiC2 is investigated. 在这项工作中，将研究Ti3SiC2的微观结构和损伤耐受机制。 The result demonstrated that the Ti3SiC2 ceramics prepared by the in-situ hot pressing/solid-liquid reaction process had a dual microstructure, i.e., large laminated grains were distributed 分散within small equiaxial grains. 结果表明，Ti3SiC2的准备原位热压/固 - 液反应过程的陶瓷双微观结构，即，大型层压颗粒被小的等轴晶粒分散开来。 This microstructure is analogous to that of platelets薄片 reinforced ceramic matrix composites. The bending test using single-edge-notched-beam specimens revealed that Ti3SiC2 was a damage tolerance material. 该组织类似于增强陶瓷基复合材料薄片。采用单边缘缺口梁试样的弯曲试验表明Ti3SiC2陶瓷损伤容限材料。 The damage tolerance mechanisms for Ti3SiC2 are basal plane slip, grain buckling, crack deflection, crack branching, pull-out and delamination of the laminated grains. Ti3SiC2陶瓷的损伤耐受机制有基面滑移，晶粒弯曲，裂纹偏转，裂纹分支，拉出和夹层颗粒分层。 Key words Ti3SiC2 Microstructure Damage mechanism Crystallite shape Introduction Titanium silicon carbide (Ti3SiC2) is a novel ceramic material, which combines the merits of both metals and ceramics. Ti3SiC2陶瓷是一种新型的陶瓷材料，它结合了金属和陶瓷的优点。 It is a good thermal and electrical conductor, not susceptible to thermal shock, and easy to machine with conventional tools. 这是一个很好的热导体和电导体，不容易受到热冲击，容易用传统工具加工。 The unit cell of Ti3SiC2 bulk materials has stimulated the research in understanding the behavior of Ti3SiC2. Ti3SiC2块状陶瓷的晶胞激发了工作人员对Ti3SiC2的行为理解研究.. Barsoum et al synthesized Ti3SiC2 bulk ceramics by reactive hot pressing method. The flexure strength of the material made by this method was 290 MPa at room temperature. Barsoum等反应热压法合成Ti3SiC2的散装陶瓷，用这种方法制成的材料在室温抗弯强度为290兆帕。 Zhou et al developed an in-situ hot pressing/solid-liquid proc