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ELMO RF aiheryhm鋘 visio 7.11.2003 RF-aihealue trendit keskeiset tulevaisuuden oletukset 2008-2013 alan SWOT-analyysi ELMO 7.11.2003 - Aktiivikomponentit/IC-teknologia, - Suunnitteluty鰇alut, - Antennit (mobiiliterminaali/tukiasema), - Suodattimet (mobiiliterminaali/tukiasema), - Integroidut komponentit, - RF-ID, - mm-wave technology- RF-testing- RF-manufacturing Nokia Research Center TTY Cetedev APLAC Solutions Oy VTT TTE TEKESFiltronic LK Oy VTT ELE Vision 2008-2013 Wireless access RF-implementation key competitive factor for multiradios. Likely to see various combinations of GSM/GPRS/EDGE/WCDMA/CDMA2000 in multiple bands. The cellular access is complemented with WLAN (IEEE802.11a/b/g), BT, RFID, GSP/Galileo, DVB-H, UWB, AM, FM etc. non-cellular systems. Managing complexity and design flow/testing becoming key issues in multiradio transceiver implementation. Multi-antenna (diversity MIMO) and on-chip tunability increase RF complexity further. - the level of design abstraction needs to be raised (e.g., AMS-VHDL), and tool integration (substrate, circuit, system) needs to be guaranteed. Tool testing challenge! Semiconductors industry for wireless is changing: only few Handset OEM develop in-house ICs. Value, technology control and innovation shifting to chip-set/platform vendors. Winning business model tbd. Terminal receiver: direct conversion architecture key enabler. Digital CMOS technology finally coming to RF: cost structure complicated, but it can provide cost benefits in high-volume transceivers with significant digital portion. Modified architectures might be needed to tolerate the high dynamic range with low supply voltage circuits, Digital CMOS enables single-chip modems. Terminal transmitter: high efficiency in wide power range needed, also in non-constant envelope modulations (EDGE, WCDMA, CDMA2000). Switch-mode power amplifiers have potential for radical efficiency improvement. Credible proof-of-concept still missi
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