Lectur+7_SP10.ppt

Lecture 7 Mechanics of Materials Today’s Lecture Stress, strain, etc. an isotropic materials Thin films: thermal stress, residual stress, and stress gradients, internal dissipation MEMS material properties and performance metrics See also /material/ Elastic constants for anisotropic materials (e.g. Si) Normal Stress = Force per unit Area Strain = fractional change in length Poisson’s Ratio Forces || to Surfaces à Shear Stress Normal and Shear Componentsfor an Isotropic Solid Isotropic = same in all directions Add in off-axis strains from normal stresses in other directions Important Special Case: Plane Stress Plane Stress Case (cont.) Linear Thermal Expansion As temperature increases, most solids expand in volume àdefine the linear thermal expansion coefficient by Why important? Source of strain (due to mismatch between layers … thin film and substrate, substrate and package, package and board, etc.) can be exploited for thermal-expansion based actuators Linear Thermal Expansion: Varies with Temperature Thermal Stress Assume film is deposited stress-free at temperature Td At room temperature Tr , the film is under a thermal mismatch strain (a “built-in” strain) given by Residual Stress in Thin Films What is measured in a thin film (e.g., by the induced substrate curvature) define as the residual stress Thermal mismatch stress: well understood What is not explained by thermal mismatch define as the intrinsic stress Origins of intrinsic stress: many and varied! Measuring (Average) Residual Strain Annealed “Stress-Free” Poly-SiGe Films Understanding the Difference betweenAverage Strain and Strain Gradient Case 1. Average strain 0 (tensile); top of film is more tensile than bottom Case 2. Average strain 0 (compressive); bottom of film is more compressive than top Failure by Fracture (or Yielding) Internal Dissipation (Losses) All materials dissipate energy when undergoing cyclic vibrations Origins (see papers by Yasumura and Candler) 1. A