第十届固态集成电路技术国际会议.docVIP

The Scope and Topics of the Conference (Papers are solicited in, but not limited to the following areas) (1) Silicon integrated circuits and manufacturing (2) Digital, Analog, Mixed Signal IC and SOC design technology (3) Low-power, RF devices circuits (4) IC Computer-Aided –Design technology (5) Silicon/germanium devices and device physics (6) Interconnect, Low K, High K and other process technologies (7) Advance memories technology (Flash, FeRAM, PCM, ReRAM, MRAM etc.) (8) Unconventional and nano-electronics (9) Organic semiconductor devices and technologies (10) Compound semiconductor devices and circuits (11) Displays, sensors and MEMS (12) Semiconductor materials and material characterization (13) Reliability (14) Modeling and simulation (15) Packaging and testing technology (16) Equipment technology (17) Solar cell other devices for new energy sources (18) Others ICSICT 2010 Organizations General Co-Chairs Name Affiliation Country/Area T.P.Ma Yale USA Shichang Zou CAS China Advisory Committee Co-Chairs Yangyuan Wang Peking China Chenming Hu UC Berkeley USA Zhijian Li Tsinghua China Chih Tang Sah CTSAH Associates and Xiamen USA/China Simon Sze NCTU Taiwan K.N.Tu UCLA USA T.C. Chen IBM USA Advisory Committee Members Xingbi Chen University of Electronic Science and Technology of China China Nathan W. Cheung University of USA Thomas Gessner Chemnitz Germany Ruqi Han Peking China Chang Huang China Aerospace Corporation China Dim-Lee Kwong Institute Singapore Kei May Lau HK University of China James E. Morris Portland USA George Rozgonyi North Carolina USA Gang Ruan Fudan China Michael Shur Rensselaer Polytechnic Institute USA Ljiljana Trajkovic Simon Canada Philip Wong Stanford USA Juyan Xu Chinese Electronics Technology Group Company China Zhongyu Yu Ministry of Information Industry China Paul Yu University of California, San Diego USA Youdou Zheng Nanjing Univeristy China Technical Program Committee Co-Chairs Ting-Ao Tang Fudan China Yue Hao Xidian Ch