添加La对Sn-Ag-Sb焊点结合强度之影响.docVIP

冷卻速率對Sn-Ag-Cu無鉛銲料Ag3Sn形貌及拉伸強度之研究 Effect of Cooling Rate on the Ag3Sn Morphology and Tensile Strength of Sn-Ag-Cu Lead-Free Solder 林冠宇1、李驊登2*、陳銀發1、林哲緯1、張銘峰1 K. Y. Lin H. T. Lee* C. W. Lin M. F. Chang 1國立成功大學機械工程研究所研究生 2國立成功大學機械工程研究所教授  摘要 本研究的目的在探討冷卻速率差異對Sn-3.0Ag -0.5Cu及Sn-3.8Ag-0.7Cu(簡稱SAC305、SAC387)無鉛銲料的金屬間化合物Ag3Sn與Cu6Sn5形貌變化之影響。並使用拉伸試驗來評估不同冷卻速率下，無鉛銲料拉伸強度性質的影響。 研究結果顯示，冷卻速率對金屬間化合物凝固成長時間有顯著的影響，造成Ag3Sn化合物尺寸及形貌上的變化。無鉛銲料隨冷卻速率下降，Ag3Sn化合物形貌變化:顆粒狀→針狀→板片狀，以快速冷卻情況下，可得到共晶組織最為細緻，快冷下Ag3Sn化合物顆粒平均直徑尺寸約略為0.2μm，使得整體組織更為均勻。拉伸強度隨Ag3Sn化合物粗大化而逐漸下降，其中SAC305拉伸強度由原本60.8MPa降至39.5MPa。由於高Ag含量的無鉛銲料SAC387於凝固過程中，內部會先析出初析Ag3Sn化合物，反而成為缺陷所在，裂紋易由此開裂，在拉伸強度及延性方面皆不及SAC305銲料。 綜合本研究結果顯示冷卻速率與Ag含量對於凝固過程中Ag3Sn化合物形貌及拉伸強度都有顯著的影響。快速的冷卻速率與微量銀元素添加，將使Ag3Sn化合物具有較佳形貌，使無鉛銲料擁有良好的機械性質。 關鍵字:Ag3Sn、Cu6Sn5、冷卻速率、Sn-Ag-Cu、機械性質 Abstract Effect of the different cooling rate on the morphological evolution of the Ag3Sn, Cu6Sn5 and β-Sn formed during the solidification of Sn-3Ag-0.5Cu (SAC305) and Sn-3.8Ag-0.7Cu (SAC387) solder was investigated. The tensile tests were used to estimate the tensile strength under different cooling rates. Experimental results showed that cooling rate has a significant effect on the solidification, and therefore influences both the size and the morphology of the eutectic Ag3Sn compound. Specifically, as the cooling rate is reduced, the Ag3Sn compound exhibits a coarsening evolution: particle-like → needle-like → plate-like. The Ag3Sn particles have an average diameter of about 0.2μm by fast cooling. The tensile strength is reduced as Ag3Sn is coarsened. The tensile strength for SAC305 decreased from 60.8MPa to 39.5MPa. SAC387 solder possesses more Ag and Cu addition than SAC305, and its tensile strength decreased more seriously due to the formation of coarse primary Ag3Sn compounds. Cracks tend to occur at plate-like primary Ag3Sn compound and extend into the matrix by SAC387 specimens under slower cooling. As a result, precipitation of such large and brittle primary compound is ha