信号完整性分析幻灯片Signal+Integrity.ppt

Signal Integrity is in your future Mu-Shui Zhang Sun-Yat Sen Univ. “There are two kinds of designers, those with signal-integrity problems and those that will have them.” on a white board at a large systems company 1.Silicon chip Wafer 代工厂 Advance in package 3. PCB--provide interconnect for package-to-package/component-to-component Computer main board Backplane Interconnect 4.Moore’s law Everything goes faster and faster! 5.What is signal integrity? Signal integrity refers, in its broadest sense, to all the problems that arise in high-speed products due to the interconnects. It is about how the electrical properties of the interconnects, interacting with the digital signal’s voltage and current waveforms, can affect performance. “There are two kinds of designers, those with signal-integrity problems and those that will have them.” on a white board at a large systems company Signal-integrity noise problems Signal integrity problems in SoP 6.This course we will discuss the following issues of SI 1.Time and frequency domain.(2 weeks) 2.Physical basis of resister, capacitor and inductor. (2 weeks) 3. Physical basis of transmission line. (2 weeks) 4.Reflection of a transmission line. (2 weeks) 5. Lossy lines, Rise time degradation, and eye diagram .(2 weeks) 6. Crosstalk in transmission lines.(2 weeks) 7.Differential pair.(2 weeks) 8.Software usage, Polar Si9000(2-D impedance calculator) and hyperlinx8.0(Signal integrity simulation) .(2 weeks) Reference books 1. Signal and power integrity ----Simplified, Eric bogatin, Second Edition. 中文版《信号完整性分析》 李玉山，李丽平译，电子工业出版社. 2.《信号完整性分析与设计》张木水，李玉山编著，电子工业出版社. Any questions? 世界集成电路的发展历史　　1947年：贝尔实验室肖特莱等人发明了晶体管，这是微电子技术发展中第一个里程碑；　　1950年：结型晶体管诞生；　　1950年： R Ohl和肖特莱发明了离子注入工艺；　　1951年：场效应晶体管发明；　　1956年：C S Fuller发明了扩散工艺；　　1958年：仙童公司Robert Noyce与德仪公司基尔比间隔数月分别发明了集成电路，开创了世界微电子学的历史； 　　1960年：H H Loor和E Castellani发明了光刻工艺；　　1962年：美国RCA公司研制出MOS场效应晶体管；　　1963年：F.M.Wanlass和C.T.Sah首次提出CMOS技术，今天，95%以上的集