IC封装【DOC精选】.docx

IC封装，就是指把硅片上的电路管脚,用导线接引到外部接头处,以便与其它器件连接.封装形式是指安装半导体集成电路芯片用的外壳。它不仅起着安装、固定、密封、保护芯片及增强电热性能等方面的作用，而且还通过芯片上的接点用导线连接到封装外壳的引脚上，这些引脚又通过印刷电路板上的导线与其他器件相连接，从而实现内部芯片与外部电路的连接。因为芯片必须与外界隔离，以防止空气中的杂质对芯片电路的腐蚀而造成电气性能下降。目录名称种类BGA(ball grid array)BQFP(quad flat package with bumper)PGA(butt joint pin grid array)C－(ceramic)CerdipCerquadCLCC(ceramic leaded chip carrier)COB(chip on board)DFP(dual flat package)DIC(dual in-line ceramic package)DIL(dual in-line)DIP(dual in-line package)DSO(dual small out-lint)DICP(dual tape carrier package)DIP(dual tape carrier package)FP(flat package)flip-chipFQFP(fine pitch quad flat package)CPAC(globe top pad array carrier)CQFP(quad fiat package with guard ring)H-(with heat sink)pin grid array(surface mount type)JLCC(J-leaded chip carrier)LCC(Leadless chip carrier)LGA(land grid array)LOC(lead on chip)LQFP(low profile quad flat package)L－QUADMCM(multi-chip module)MFP(mini flat package)MQFP(metric quad flat package)MQUAD(metal quad)MSP(mini square package)OPMAC(over molded pad array carrier)P－(plastic)PAC(pad array carrier)PCLPPFPF(plastic flat package)PGA(pin grid array)piggy backPLCC(plastic leaded chip carrier)P－LCCQFH(quad flat high package)QFI(quad flat I-leaded packgac)QFJ(quad flat J-leaded package)QFN(quad flat non-leaded package)QFP(quad flat package)QFP(FP)(QFP fine pitch)QIC(quad in-line ceramic package)QIP(quad in-line plastic package)QTCP(quad tape carrier package)QTP(quad tape carrier package)QUIL(quad in-line)QUIP(quad in-line package)SDIP (shrink dual in-line package)SH－DIP(shrink dual in-line package)SIL(single in-line)SIMM(single in-line memory module)SIP(single in-line package)SK－DIP(skinny dual in-line package)SL－DIP(slim dual in-line package)SMD(surface mount devices)SO(small out-line)SOIC(small out-line integrated circuit)SOJ(Small Out-Line J-Leaded Package)SQL(Small Out-Line L-leaded package)SONF(Small Out-Line Non-Fin)SOF(small Out-Line package)SOW (Small Outline Package(Wide-Jype))COG(Chip on Glass)名称种类BGA(ball grid array)BQFP(quad f