芯片绑定介绍.ppt

WIRE BOND PROCESS INTRODUCTION CONTENTS 封裝簡介 封裝流程 Wafer Grinding Wire Bond 原理 B.PRINCIPLE 銲接條件 Bond Head ASSY X Y Table W/H ASSY Eagle Eagle Eagle Bonding Process The Wire Bond Temp Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Formation of a first bond Formation of a first bond Formation of a first bondContact Formation of a first bondBase Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Capillary rises to loop height position Formation of a loop Formation of a loop Formation of a second bond Formation of a second bondContact Disconnection of the tail Disconnection of the tail Formation of a new free air ball Material Leadfram (I) Leadfram ( II ) CAPILLARY (I) CAPILLARY (II) CAPILLARY (III) TIP ..…… Pad Pitch Pad pitch x 1.3 ~ TIP Hole ..…. .Wire Diameter Wire diameter + 0.3~0.5 = H CD………Pad size/open/1st Ball CD + 0.4 ~ 0.6 = 1st Bond Ball size FA OR….Pad pitch(um) FA 100 0,4 ~90/100 4,8,11 90 11,15 IC type …… loop type Gold Wire SPEC BPOBPP Ball Size Ball Thickness Loop Heigh Wire Pull Ball Short Shear Failure Modes Crater Test Calculate (I) Calculate (II) Quality 正常品 Material Problem Bonding Ball Inspection Ball Detection Bonding Ball Inspection (cont.) Ball Measurement 1st Bond Fail ( I ) 1st Bond Fail (II) 1st Bond Fail ( III ) 1st Bond Fail (IV) 1st Bond Fail (V) Bonding Weld Inspection Weld Detection 2nd Bond Fail ( I ) 2nd Bond Fail ( II ) Looping Fail(Wire Short I) Looping Fail