【物理】简介英文版临辉电子.pptVIP

Our Manufacturing Capability Major Material Lay-up Major FPC Equipment List 深圳市临辉电子科技有限公司 DAWN Technology Co., Ltd Company Profile The Company was established in 2003. Mass production was started in April 2005. Hong Kong Based FPCB manufacturer wholly owned. Our Major Products are Produce S/S, D/S to 8 Layers FPC and multi-layers Rigid-Flex FPC. UL, ISO9001 (2000) ISO14000 Will be Certificate Authority in September 2005. HD-Flex perceived that FPC (Flexible Printed Circuit) to be the focus of market development. Our production capacity for FPC is 20000m2 / month. over 800 employees. Quick response delivery. Provide quick turnaround service to speed up customers time-to-market strategy. Our well-trained and dedicated associates will pursue total customers satisfaction by quality performance, cost saving and on-time delivery. Competitive pricing. Key Benefits to Customers Min line width/space S/S 2mil/2mil D/S 3mil/3mil 4/L 3mil/3mil 6/L 3mil/3mil 8/L 4mil/4mil Min Hole Size 0.25 mm Min Land Diameter 0.40 mm Min Board Thickness 3mil Min punching hole 0.3 mm Max Panel Size 460 mm x 616 mm Finishing In-house capability of Entek, Immersion Gold, Flash Gold, Bright Solder Plating, Pure Tin Plating. Silver print carbon print Flexible PCB Single-sided, Double-sided Multi-layer FPC Rigid-Flex Bare copper for S/S D/S. 1.Base Material 2. Cover layer Type Sort Thickness Base Material Copper PI (Polyimide)* PET (Polyester) 1/2 mil* 1 mil* 2 mil 1 mil 2 mil — RA* ED Bare Cu RA ED 18μm(1/2oz)* 35μm(1/2oz)* 70μm(1/2oz)* 12μm(1/2oz) 18μm(1/2oz) 35μm(1/2oz) Type Coverlay PI (Polyimide)* PET (Polyester) Thickness 1/2 mil* 1 mil* 2 mil 1/2 mil* 1 mil 2 mil 3. Adhesive 4. FPC Board Structure Type Sort Thickness adhesive Stiffener film Stiffener Horniness AD( Cold Melt) AD( Hot Melt) AD(Hot Solid) 12um 25um 50um 12um 25um 50um 12um 25um PI(Polyimide) 1mil,2mil,3mil,5mil,8mil,9mi