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Optimization of the thermal contact resistance within press pack IGBTs.pdf
Microelectronics Reliability 69 (2017) 17–28
Contents lists available at ScienceDirect
Microelectronics Reliability
journal homepage: /locate/microrel
Optimization of the thermal contact resistance within press pack IGBTs
Erping Deng a,b,?, Zhibin Zhao a, Peng Zhang b, Yongzhang Huang a, Jinyuan Li b
a State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Changping District, Beijing 102206, China b State Grid Global Energy Interconnection Research Institute, Changping District, Beijing 102211, China
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