Optimization of the thermal contact resistance within press pack IGBTs.pdfVIP

Microelectronics Reliability 69 (2017) 17–28 Contents lists available at ScienceDirect Microelectronics Reliability journal homepage: /locate/microrel Optimization of the thermal contact resistance within press pack IGBTs Erping Deng a,b,?, Zhibin Zhao a, Peng Zhang b, Yongzhang Huang a, Jinyuan Li b a State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Changping District, Beijing 102206, China b State Grid Global Energy Interconnection Research Institute, Changping District, Beijing 102211, China article info Article