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Optimization of the thermal contact resistance within press pack IGBTs.pdf

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Optimization of the thermal contact resistance within press pack IGBTs.pdf

Microelectronics Reliability 69 (2017) 17–28 Contents lists available at ScienceDirect Microelectronics Reliability journal homepage: /locate/microrel Optimization of the thermal contact resistance within press pack IGBTs Erping Deng a,b,?, Zhibin Zhao a, Peng Zhang b, Yongzhang Huang a, Jinyuan Li b a State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Changping District, Beijing 102206, China b State Grid Global Energy Interconnection Research Institute, Changping District, Beijing 102211, China article info Article history: Received 25 August 2016 Received in revised form 8 January 2017 Accepted 8 January 2017 Available online 11 January 2017 Keywords: Press pack IGBTs Thermal contact resistance Temperature Clamping force Nanosilver sintering technology abstract The research of thermal contact resistance between multi-layers within press pack IGBTs (PP IGBTs) is signi?cant for optimizing the PP IGBTs thermal resistance to improve reliability, as the thermal contact resistance accounts for approximately 50% of the total thermal resistance of PP IGBTs. In this paper, thermal contact resistance between multi-layers is analysed via a ?nite element model (FEM) of a single fast recovery diode (FRD) submodule. Most importantly, the in?uence of temperature and clamping force on the thermal contact resistance is also discussed, and ?ndings are veri?ed by submodule thermal resistance experiments. Based on the FEM and experimental results, nanosilver sintering technology is proposed to ?ll the gap between the contact interfaces to reduce thermal contact resistance. The fabrication of a sintered single FRD submodule is also investigated in this paper, and the results of the sintered sample indicate that the thermal resistance is reduced by approximately 18.8% compared to a direct contact sample. ? 2017 Elsevier Ltd. All rights reserved. 1. Introduction To meet the growing requirements of applications