学位论文-低银无铅焊料的动态力学性能研究固体力学.doc

密 级： 学校代码：10075 分类号： 学 号 工 学 硕 士 学 位 论 文 低银无铅焊料的动态力学性能研究 学位申请人： 李娜 指导教师： 牛晓燕 副教授 学位类别： 工学硕士 学科专业： 固体力学 授予单位： 河北大学 答辩日期： 二○一四年五月 Classified Index: CODE: 10075 U. D. C. NO: A Dissertation for the degree of M. Engineering Study on Dynamic Mechanical Properties of Low Silver Lead-Free Solder Candidate: Li Na Supervisor: A.P. Niu Xiaoyan Academic Degree Applied for: Master of Engineering Specialty: Solid Mechanics University: Hebei University Date of Oral Examination: May, 2014 摘 要 便携式电子产品在运输与使用过程中经常会发生跌落与撞击等问题，要求焊点具备优异的抗跌落性能。另外，电子元器件在服役过程中会放出大量的热量，导致焊点温度升高，我国部分地区冬季的温度历史上最低达为-50℃左右，也会影响焊点的实际温度，对电子产品在较低或较高的温度下使用都会影响焊点的力学性能，从而影响其寿命。目前对低温下焊点的力学性能研究还很少。随着人类环保意识的增强及电子行业对成本的控制，低银无铅焊料逐渐取代了高银无铅焊料。也为焊点的可靠性提出了新的课题。 基于以上问题，本文对低银无铅焊料的力学性能以及焊点的可靠性进行了系统性的研究，主要工作和结果如下： 在不同工况下，采用试验机和分离式霍普金森压杆装置（SHPB）低银无铅焊料Sn0.3Ag0.7CuAbstract It is inevitable to cause the portable electronic products drop or impact in the process of transportation or application，so we expect the solder joints own excellent resistance to drop .In addition, the electronic components will release a lot of heat in the process of service, and lead to high temperature of solde accordingly. The lowest temperature of our country in the history is around for - 50 ℃, which will affect the mechanical properties of solder joints in the use of electronic products under low or high temperature, thus the life of electronic products to use is affected. Currently, there is little research about the mechanical properties of solder joints under low temperature. Along with the improve of human awareness of environmental protection and cost control of electronic industry, low-silver lead-free solders products were gradually replaced high-silver solder products, also put f