ThroughHole通孔填孔FillPlating电镀铜技术.pdfVIP

Through Hole 通孔填孔 Fill Plating 电镀铜技术 MICROFILL? THF 100 Electrolytic Copper MICROFILL? THF-100 Electrolytic Copper is designed for through hole ?ll application which is applied to inner core layer ?lled on IC Substrate. Compared to traditional process, new technology improves reliability, conductibility and electrical connections. Other reachable bene?ts include process cost reduced and manufacturing processes shortened. MICROFILL? THF-100电镀铜为基于通孔电镀填孔应用 所开发之专用光泽剂,多应用于IC载板核心层板。相 对于传统制造流程,新技术可提高信赖度,导电性与电 性连结。且可降低成本,缩短制造流程的优势。 Advantages 优点 ? DC Process 搭配直流电镀设备 ? Excellent through hole ?ll performance 优异的通孔填孔效果 ? CVS can be applied for bath control 可使用CVS分析以简化槽液管控 ? Elimination of conductive paste, ink and solvents 无需导电膏印刷,无油墨与溶剂影响 ? Highly conductive, improved thermal properties 高导电度与耐热性 ? Excellent copper to copper adhesion, provides improved reliability 优良的铜层连结附着性,并提高信赖度 ? Reduced CTE mismatch within ?lled via structure 填孔结构可改善热膨胀公差 ? Reduced cost/Increased productivity 降低成本/提升产能 Performance 效能 15 μm Current Density: 1.5 A/dm2 Board thickness: 200 μm TH diameter: 100 μm Plating thickness: 15/20/25μm 20 μm 25 μm Hole Plug Process 内层塞孔制程 Through hole ?ll plating process 通孔填孔电镀制程 Through hole ?ll 通孔填孔电镀 Integrated into one process 制程大幅简化 Patterning 线路制作 Conventional Process 传统塞孔制程 Dielectric and Stack 增层迭孔 Conformal plating 通孔电镀 Paste /Ink ?lling 网印塞孔 Planarize 板面整平 Cap plating 板面电镀 ? ? Trademarks of The Dow Chemical Company (“Dow”) or an af?liated company of Dow