A -Band Front-End With 3-D Integrated Cavity FiltersDuplexers and Antenna in LTCC Technolog.pdfVIP
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A -Band Front-End With 3-D Integrated Cavity FiltersDuplexers and Antenna in LTCC Technolog
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 54, NO. 7, JULY 2006 2925
A V -Band Front-End With 3-D Integrated Cavity
Filters/Duplexers and Antenna in LTCC Technologies
Jong-Hoon Lee, Student Member, IEEE, Nobutaka Kidera, Gerald DeJean, Student Member, IEEE,
Stéphane Pinel, Member, IEEE, Joy Laskar, Fellow, IEEE, and Manos M. Tentzeris, Senior Member, IEEE
Abstract—This paper presents a compact system-on-package-
based front-end solution for 60-GHz-band wireless commu-
nication/sensor applications that consists of fully integrated
three-dimensional (3-D) cavity filters/duplexers and antenna.
The presented concept is applied to the design, fabrication, and
testing of -band (receiver (Rx): 59–61.5 GHz, transmitter (Tx):
61.5–64 GHz) transceiver front-end module using multilayer
low-temperature co-fired ceramic technology. Vertically stacked
3-D low-loss cavity bandpass filters are developed for Rx and Tx
channels to realize a fully integrated compact duplexer. Each
filter exhibits excellent performance (Rx: IL 2 37 dB, 3-dB
bandwidth (BW) 3.5%, Tx: IL 2 39dB, 3-dB BW 3.33%).
The fabrication tolerances contributing to the resonant frequency
experimental downshift were investigated and taken into account
in the simulations of the rest devices. The developed cavity filters
are utilized to realize the compact duplexers by using microstrip
T-junctions. This integrated duplexer shows Rx/Tx BW of 4.20%
and 2.66% and insertion loss of 2.22 and 2.48 dB, respectively.
The different experimental results of the duplexer compared
to the individual filters above are attributed to the fabrication
tolerance, especially on microstrip T-junctions. The measured
channel-to-channel isolation is better than 35.2 dB across the Rx
band (56–58.4 GHz) and better than 38.4 dB across the Tx band
(59.3–60.9 GHz). The reported fully integrated Rx and Tx filters
and the dual-polarized cross-shaped patch antenna functions
demonstrate a novel 3-D deployment of embedded components
equip
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