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Technolog Trend 2009 March.pdf

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Technolog Trend 2009 March

Technology Trend Dr. Hayao Nakahara N.T. Information Ltd March, 2009 Technology Trend ? LDI Imaging Inkjet Printing ? Printed Electronics ? Embedded Components ? Stacked Wafer Package: WB→TSV ? Embedded Circuits (Trench) ? Paste Technologies Laser Direct Imaging Inkjet Printer Printed Pattern Embedded Components Thick Film technology has been around for a long time Japanese like to use chip components Casio Watch Module using WLP by CMK One-Seg TV Receiver Module by Toppan NEC Currently, the best estimate of buried components PCB production is about $300 million worldwide, of which probably $200 million comes from ZBC technology Sanmina-SCI’s ZBC Buried Capacitance Technology Sanmina-SCI Confidential BC? 材料のクロスセクション BC? Material Cross Sections FaradFlex? BC-16T FaradFlex? BC-12TM セラミック系フィラー入りエポキシ樹脂 FaradFlex? BC-24 FaradFlex? BC-16 FaradFlex? BC-12 FaradFlex? BC-8 エポキシ樹脂 InterraTM HK 04 ポリイミド樹脂 ZBC-2000? and ZBC-1000? 主にFR-4（エポキシ）基材 FaradFlexTM は、Oak Mitsui Technologies社の商標です。 InterraTM は DuPont Electronic Materials社の商標です。 OCCAM Process One problem buried components PCB has today is its high cost. However, initial high cost of microvia board was overcome and now more than 20% of all PCBs made today are microvia boards. Flip-Chip Continues Gain Device Type 2006 2007 2008 2009 MPU 267 296 337 320 Games 37 82 100 120 DSP 10 15 23 34 ASIC/Switch 94 128 152 130 FPGA 10 13 17 22 Graphics 160 220 230 200 Chipsets 237 368 385 360 Total 815 1122 1244 1186 Flip Chip Substrate Demand (Million) (Techsearch International NTI) But, the number of players is small Maker 2005 2006 …. 2008 …. 2010 Ibiden 25 30 35 40 Nanya 20 25 40 45 Shinko 13 18 20 24 Samsung 5 10 15 20 NTK 2 7 15 20 Other* 3 15 20 30 Total 68 105 145 179 (N.T. Information Ltd) Flip-Chip Substrate Makers and Capacities (Unit: million pieces/month) * Others include PPT, Kinsus, Kyocera SLC, Yoppan-NEC, EIT Etc 68x65mm PTFE-SIP in MCM Format 17mm ASIC, Designed to mount up to 8 additional memory devices (E