焊接材料的展现状与发展趋势.doc

焊接材料的发展现状与发展趋势 陈昌旭 （桂林电子科技大学 0500150206） 摘　要：近年来，虽然在电子封装行业中仍然存在着不少的企业在继续采用有铅焊料，但是这并不妨碍“无铅化”成为电子材料、微电子制造、电子封装和SMT等有关的国际研讨会和学术交流会的中心内容或者是主要议题，几十种专业技术刊物几乎每一期都有无铅专题，在百度或Google等著名名搜索引擎上，可找到的“无铅化”信息有成千上万条，而且还在不断增加中[1]。无论是环境的要求还是作为竞争的筹码，无铅焊料在表面组装领域中的应用已经是不可回避。然而无铅化仍然存在材料、工艺、设备、系统兼容等问题。在解决材料及电子产品可靠性的同时电子工业正在向无铅组装转变。这一努力是由环保方面的考虑，政府的立法以及无铅电子封装的市场利益所驱动的[2]。在无铅组装的执行中虽然需要做出许多的决定，但不可否认的是，无铅焊料已经逐渐成为电子封装行业中的当前以及未来主要的焊接材料。 关键词：焊接材料，发展趋势，无铅 The development of welding materials and the development trend chen chang xu (Guilin University of Electronic Science and Technology 0500150206) Abstract:In recent years, although the electronic packaging industry there are still many enterprises were to have lead solder, but this does not preclude the lead-free has become electronic materials, microelectronics manufacturing, such as electronic packaging and SMT The international seminars and academic exchanges will be at the centre or the main topic, dozens of professional and technical publications have lead-free period of almost every topic, in Baidu or Google search engine and other well-known name, can find the Lead Thousands of information, but also continue to increase. Whether environmental requirements or as a bargaining chip in competition, lead-free solder assembly on the surface in the field of application is already unavoidable. But there are still lead-free materials, technology, equipment, systems compatibility and other issues. In resolving the reliability of materials and electronic products, while the electronics industry are changing to lead-free assembly. This effort by environmental considerations, the Governments legislative and lead-free electronic packaging market-driven interest. Lead-free assembly in the implementation Although many need to make the decision, but it is undeniable that lead-free solder has gradually become the electronic packaging industry in the current and future major welding materials. Key words: welding materials, development trends, unleaded 1 焊接