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Introduction to High-k Gate Stacksz
Chapter 1
Introduction to High-k Gate Stacks
Samares Kar
Abstract The manifold aim of this chapter is: (1) to present a simple summary of
the contents of the eleven other chapters of the book in a manner as continuous and
cohesive as possible; (2) more importantly, to provide the basics, the definitions,
simple explanations, and the missing links; (3) and to acclimatize the uninitiated
reader. This chapter begins with an historical account going back some four decades
when research was initiated into the Metal Oxide Semiconductor (MOS) tunnel
diodes much ahead of its commercial adoption for nano-transistors. An introduction
is then presented into the desirable characteristics of a current and future high-k gate
stack followed by a discussion of the properties of the available and possible high-k
candidates to replace the single SiO2 gate dielectric. The subsequent sections of the
chapter deal with: (a) the basics, theory, and characteristics of the MOS structures
and the MOS field effect transistor including its energy band diagrams, equivalent
circuits, admittance-voltage and current–voltage characteristics, and parameter
extraction methodologies; (b) the physics of the Hf-based gate stacks, which is the
current favorite; (c) the processing of the Hf-based gate stacks including process
optimization and control; (d) metal gate electrodes, work-function tuning, and metal
gate integration; (e) the flat-band and threshold voltage anomaly including the role
of the bottom and the top interface dipoles in this anomaly; (f) the channel mobility
including the scattering mechanisms, the factors behind its degradation, and the
options for attaining high mobility; (g) the mechanisms of gate stack degradation
including fast and slow charge trapping and the reliability issues; (h) physics and
technology of Ln-based gate stacks—perhaps the next generation; (i) the ternary
higher-k gate dielectric materials including the roles of the structure modifiers and
the higher-k phase stab
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