HDIManufacturingReview.docVIP

HDI Manufacturing Review 1. Background Today, PCB Business has been entering into a stage of steady growth whatever you stand from the total demand or technology development. As long as PCB plays as a critical role in infrastructure of electronics, outcome of HDI manufacture is trying to meet these electronic devices with smaller in size lighter in weight. Generally speaking, a more 3D complex design is used to fulfill greatly increased interconnection circuit. Indeed, HDI manufacturing now faces with three major concerns on its self-development: Performance, Lower costs and Reliability. Toward performance concern, lighter weight, smaller size, higher wiring density, better electrical properties and lower RFI/EMI will be the main directions. Then, about the lower costs, reducing layers number, lower costing/unit of performance, efficient design with faster layering and high yield will play the key roles as to achieve maximization of profit. Of cources, better thermal performance and high Tg with low dielectric constant materials will be critical to ensure the better reliability. HDI classification About today’s advanced PCBs, they are now containing blind via buried via which are produced by conventional drilling or lamination processes. Mainly, their connection density is ranged from 65 to 150 connections within 1 sq. inch (10 to 24 connection per 1 sq. cm). Compared to HDI manufacturing, PCB/Substrates not only have 130 connections per 1 sq. inch (21 per sq. cm) at least, but also comprised of less than 6 mil diameters’ microvia, blind and buried via’s OR any PCB/Subrates with micro/blind via which is made by alternative method, not for conventional one.1 Following settings consolidate general HDI manufacturing criteria:- Line Space : 50 – 75 ?m line / 75-100 ?m space Via diameter : 20 – 25 per sq. cm Micro Via/Capture Pad : 250 – 400 ?m / 300 – 500 ?m BlindVia depth : 60 – 80 ?m Fine pitch : 50 ?m pitch Interconnection / cm2 : 10 – 24 per sq. cm Materia