Ashing - hardware and process.pdf

Cameo?Consulting Stripping and Cleaning: The Tenacity of Plasma Processing Prepared for xxx Karen Reinhardt PESM September 2007 Cameo?Consulting Presentation Contents A little history… (OK a lot of history) What are the current stripping challenges? How are these challenges addressed? What is the future for plasma stripping? Conclusion… Why plasma is here to stay At least for a while… Cameo?Consulting Caveman Plasma 1 μm geometries Batch barrel reactor Simple reactor design Basic O2 plasma N2 and CF4 addition Uniformity But who cares, just over-ash Charging!!! But who cared, just wet etch the damaged oxide away Residue!!! But who cared, just remove it in NMP Particle!!! But who cared, other systems were a lot worse “That new microwave tuning technique really works” Branson Pre-1985 Cameo?Consulting Simple Resist Ashing Bulk resist In the good ole days… first ashing and then cleaning Not much polymer Little residue Send it to the next step… Some particles Cameo?Consulting Simple Plasma Reactors Branson/IPC LFE Tegal In the good ole days… batch processors and no automation Cameo?Consulting SPM or solvent clean step And Simple Recipes Followed by Plasma chemistry Additives RF 13.56 MHz power Pressure Temperature Process time 2000-10000 sccm O2 0-20 vol% N2 0-25 vol% CF4 500-2000 Watts 0.5-5.0 Torr 150-325°C 30-90 min Batch downstream RF barrel reactor recipe Bulk photoresist stripping process Cameo?Consulting Renaissance Plasma 0.25 to ~1.0 μm geometries Single wafer Simple platform Downstream stripping technology Still basic O2 plasma CF4 addition Uniformity is a lot better Charging is addressed Baffles Residue is addressed Just etch it away! Still a lot of particles And still, who cared, other systems were a lot worse The morning production meeting 1985-1998 Cameo?Consulting Importance of Residues Removal Realized The realization that residue, metallic contamination, and particles effected yield drove the need for cleaning Reference: Via: S. Lutter