Biochemical eng J08-Adsorption of copper on rubber (Hevea brasiliensis) leaf powder.pdf

AC ( p f a p b C w a ? K 1 v m m m r o h i c m t w t [ 1 dBiochemical Engineering Journal 39 (2008) 521–530 Adsorption of copper on rubber (Hevea brasiliensis) leaf powder: Kinetic, equilibrium and thermodynamic studies W.S. Wan Ngah ?, M.A.K.M. Hanafiah School of Chemical Sciences, Universiti Sains Malaysia, 11800 Penang, Malaysia Received 27 April 2007; received in revised form 24 October 2007; accepted 11 November 2007 bstract The adsorption of Cu(II) ions from aqueous solution by rubber (Hevea brasiliensis) leaf powder (RHBL) was studied in a batch adsorption system. haracteristics of RHBL such as pH of aqueous slurry, pH of zero point charge (pHZPC), surface area and pore diameter, Fourier transform infrared FTIR), scanning electron microscopy (SEM) and electron dispersive spectroscopy (EDS) were investigated. Factors influencing adsorption such as H of the solution, adsorbent dosage, particle size, copper concentration and temperature have been studied. The adsorption process was relatively ast and equilibrium was achieved after about 60 min. Maximum adsorption of Cu(II) ions occurred at around pH 4–5. The kinetic data were nalyzed using various kinetic models particularly pseudo-first-order, pseudo-second-order, Ritchie’s-second-order and intraparticle diffusion. The seudo-second-order kinetic model was found to agree well with the experimental data. Adsorption equilibrium data could also be described well y Langmuir, Freundlich and Dubinin–Radushkevich isotherm models. Based on the Langmuir isotherm, the monolayer adsorption capacity of u(II) ions was 8.92 mg g?1. Thermodynamic parameters such as enthalpy change (H?), free energy change (G?) and entropy change (S?) ere calculated and adsorption process was spontaneous and exothermic. Copper removal by RHBL involved different kinds of mechanisms such s ion-exchange, complexation and physisorption. 2007 Elsevier B.V. All rights reserved. odyn i t f l a h l g l t d R b heywords: Adsorption; Copper; Rubber le