La对Sn0.3Ag0.7Cu回流焊点纳米力学行为影响讲述.doc

哈尔滨工业大学工学硕士学位论文 哈尔滨理工大学学士学位论文 - PAGE II - -  PAGE II - La对Sn0.3Ag0.7Cu回流焊点纳米力学行为影响 摘要 随着电子产品的小型化，薄型化，多功能化；传统的穿孔插装元件已不能符合要求，这就要求电子产品中焊点越来越小，从而焊点所需承载的力学，电学和热学负荷越来越重。由于传统锡铅钎焊中Pb对人类生活环境有较大危害，随着人们环保意识以及健康意识愈发增强，采用无铅钎料替代传统的锡铅钎料已经成为一种必然趋势。 在众多无铅钎料中，Sn-Ag-Cu钎料具有良好的延展性，润湿性，光亮度，力学性能。Sn-Ag-Cu系列钎料合金是目前替代Sn-Pb共晶钎料的首选合金。但当前所使用的普遍为高银钎料，成本较高且质量相比较低。 本课题在前人研究的基础上，以低银Sn-0.3Ag-0.7Cu ﹑Sn-0.3Ag-0.7Cu0.03La﹑Sn-0.3Ag-0.7Cu-0.05La﹑Sn-0.3Ag-0.7Cu-0.07La﹑Sn-0.3Ag0.7Cu0.10La﹑Sn0.3Ag0.7Cu0.25La无铅钎料为研究对象，通过纳米压痕法，研究微量稀土元素对焊点硬度﹑弹性模量和蠕变性能的影响。 研究表明，稀土元素La的加入使得Sn-0.3Ag-0.7Cu无铅钎料组织的到细化，相应的提高了钎料的压痕硬度、弹性模量。另一方面，随着La元素含量的增加，钎料焊点的抗蠕变性能也依次增加。总结上述现象可知：稀土元素La的加入对Sn-0.3Ag-0.7Cu无铅钎料的压痕硬度、弹性模量以及抗蠕变性能都有积极的促进作用。 关键词：　La；低银无铅钎料；BGA；纳米压痕；蠕变性能 Impact of La on Sn0.3Ag0.7Cu Reflow Point Nano-Mechanical Behavior Abstract With the demand of miniaturization, thin, multifunctional to electronic products；traditional perforation cartridge element has been unable to meet the requirements. It requires that the solder joints of electronic products should be smaller and smaller; it caused that the solder joints should bearing more heavier mechanical loading, electrical loading and thermal loading. Along with increasing of the people’s environmental protection consciousness and the health consciousness, result of the traditional tin-lead solder Pb’s harm to the human living environment, it has become an inevitable trend that people choose the lead-free solder to  HYPERLINK /s?wd=substitute%20for \t _blank substitute for the traditional tin-lead solder. Above all of the lead-free solders, Sn-Ag-Cu solder has high ductility, wet ability bright appearance. Sn-Ag-Cu series solder alloy is the most perfect alloy to take place of Sn-Pb eutectic solder. But the generally solder are always the high silver solder, they take a high cost and low quality. Base on the research of the predecessor, Sn-0.3Ag-0.7Cu ﹑Sn-0.3Ag-0.7Cu0.03La﹑Sn-0.3Ag-0.7Cu-0.05La﹑Sn-0.3Ag-0.7Cu-0.07La﹑Sn-0.3Ag0.7Cu0.10La﹑Sn0.3Ag0.7Cu0.25Lalead-free solder