真空烧结温度对铜基减磨材料性能的影响.pdfVIP

学兔兔 第29卷第3期 粉末冶金技术 V0l_29．No．3 2011年6月 Powder Metallurgy Technology Jun．20ll 真空烧结温度对铜基减磨材料性能的影响 路艳峰 郭二军 王丽萍 康福伟 (哈尔滨理工大学材料科学与工程学院，哈尔滨 150040) 摘 要： 以铜粉、锡粉、铅粉等为原料，采用“压制 一烧结”工艺制备了铜基减磨材料，烧结采用真空无压烧 结和还原气氛保护烧结两种工艺方法。运用对比试验的方法，探讨了真空无压烧结工艺中不同烧结温度对铜 基减磨材料烧结体性能的影响。结果表明：真空烧结工艺与还原气氛保护烧结工艺相比，相同的烧结温度下 材料的孔隙度、抗拉强度、抗压强度和硬度变化不大；采用真空烧结工艺时，随着烧结温度的升高材料的硬度、 抗拉强度和抗压强度增加，材料的孔隙度降低。 关键词：真空烧结；铜基减磨材料；烧结温度；性能影响 Influence of vacuum sintering temperature on properties of copper base antifriction material Lu Yanfeng，Guo Erjan，Wang Liping，Kang Fuwei (School of Materials Science and Engineering，Harbin University of Science and Technology，Harbin 150040，China) Abstract：The copper base antifriction material was prepared by pressing—sintering process(no pressure sintering in vauum and sintering in reduction atmosphere)using copper，tin and lead powders as raw materials．The influe．nces of different sintering temperatures on the properties of copper based ahtifriction material processed in vacuum sintering were discussed．The result shows that at the same sintering temperature，the porosity，the tensile strength，the compressive strength and the hardness of copper based antifriction material produced by vacuum sintering have little change compared with that by reduction atmosphere sintering．When using vacuum sintering，the hardness，the tensile strength and the compressive strength of the material increase and the porosity of the material