PCB印刷电路板制程介绍.pptVIP

光分解反应(正性工作)→ 底片,STENCIL(网版) 光聚合反应(负性工作)→ 底片,STENCIL(网版) BURIED VIA LAY-UP A = THROUGH VIA HOLE (导通孔) B = BURIED VIA HOLE (埋孔) C = BLIND VIA HOLE (盲孔 ) D = BLIND HOLE MLB VIA (多层盲孔) BLIND VIA LAY-UP BLIND VIA SEQUENTIAL LAY-UP A B B A C C A RESIN B-STAGE BLIND AND BURIED VIA OPTION (盲 埋 孔 之 选 择 ) D 6 – Spindle Drilling Machine Black Hole Line Desmear Dry Film Laminator Automatic Exposure Machine Pattern Plating Line Etching Line Automatic S/M Printing Line Automatic Exposure Machine Post Cure Line Automatic Legend Printing Line Solder Leveling Machine O/S Tester The End PCB Engineering