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Molded Underfill (MUF) Technology for Flip Chip Packages in Mobile Applications Joshi M., Pendse R., Pandey V., Lee T.K., Yoon I.S., Yun J.S., Kim Y.C., Lee H.R., STATS ChipPAC Inc. Abstract well as known-limitations are also described along with future plan. Further studies are being conducted to characterize and Increased functionality requirements coupled with qualify MUF on larger die sizes and/or with finer bump progressively reducing package size have necessitated the pitches and to establish the process and reliability margins of integration of flip chip packages into various baseband and MUF with the same. application processor products in mobile platforms. Such products use flip chip technology using traditional capillary 1. Introduction underfill (CUF) process on a strip based package which is MUF is inherently conducive process for mobile products subsequently over molded to finish the end-product assembly. as they are often made in CSP format using strip type The growing pricing pressures and competitive landscape in substrates which can be molded using traditional mold mobile-packaging has made it imperative for assembly systems. Conventional flip chip CSP used in mobile products sub