电子封装用Fe-Ni薄膜的电沉积工艺探索-中国科学院金属研究所.PDF

第2 卷 第1 期 微电子期刊 Vol.2 No.1 2012 年3 月 Scientific Journal of Microelectronics(SJM) Mar. 2012 电子封装用Fe-Ni薄膜的电沉积工艺探索﹡ 1 2 2 1 张昊 ，张黎 ，段珍珍 ，刘志权 1 中国科学院金属研究所 沈阳材料科学国家实验室，辽宁 沈阳110016 2 江阴长电先进封装有限公司，江苏 江阴214431 摘 要：采用电沉积方法在硫酸盐—抗坏血酸体系中进行Fe-Ni UBM镀层的制备。利用赫尔槽对电镀工艺参数进行了初步 筛选，通过研究镀液中Fe2+ 浓度、铁、镍阳极的相对面积比、温度、电流密度、添加剂含量等因素对镀层成分的影响规律， 确定了电沉积Fe-Ni镀层的适宜条件及工艺参数。利用EDX 、SEM及XRD分别对镀层的成分、形貌及结构进行了分析，验证 性试验结果表明，制得的UBM镀层含铁量为 27.92%~72.41% ，晶体结构随着铁含量的增加从单一的γ 固溶体转变为α 固溶体。 利用自行定制的晶圆电镀系统成功地将Fe-Ni合金镀层的用途扩展到晶圆级BGA封装的UBM 中。 关键词：Fe-Ni 合金；电沉积；电子封装 The Process Exploration of Electro-deposited Fe-Ni Films Applied in Microelectronic Packaging 1 2 2 1 Hao Zhang , Li Zhang , Zhenzhen Duan , Zhiquan Liu 1 Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 110016, China 2 Jiangyin Changdian Advanced Packaging Co., Ltd., 275 Binjiang Road, Jiangyin 214431, China Abstract: Fe-Ni UBM plating was conducted by electro-deposition method with sulfate-ascorbic acid system, and the process parameters of electroplating was preliminary filtered by hull cell experiment. Through the investigation of the effect of electroplating parameters such as concentration of Fe2+, the relative area ratio of Fe/Ni anodes, temperature, current density, and content of additive on the content of plating, suitable conditions, and processing parameters of Fe-Ni UBM plating were determined. Scanning electron microscope (SEM) and X-ray diffraction (X