光热二重固化环氧丙烯酸酯导电胶的制备及其固化机理.pdfVIP

哈尔滨工业大学理学硕士论文 Abstract In order to solve the questions of curing temperatures are high, time is long for conductive adhesive curing only by heating, and incomplete curing only by pure UV light, in this paper, epoxy acrylate resin is prepared and UV-thermal dual curing technology is be used. The conductive adhesive is prepared by epoxy acrylate resin and the optimum amount of each component, optimum curing conditions are studied, at last, curing mechanism of the conductive adhesive is studied. The epoxy acrylate resin with 1/4, 1/3, 1/2, 5/8, 3/4, 7/8, 1/1 esterification ratios are synthesized by E51 and α-methacrylic acid. The reaction times and conversion ratios of the epoxy acrylate resin are determined and characterized by testing epoxy value and FTIR. The adhesives are prepared by these epoxy acrylate resin and the mechanical and heat resistance properties of the curing film after cured the adhesives by UV-thermal method and the 5/8 esterification resin is determined the suitable for preparing conductive adhesive. The conductive adhesive is prepared with 5/8 esterification resin through UV-thermal dual curing technology and the optimum amount of the diluents, photoinitiators, thermal initiators, curing agents and the conductive filler of the conductive adhesive are 20%, 3.5%, 1.5%, 10%, 60%. The most suitable curing temperature is 140 ℃, curing time is 120~300s. The tensile 拉伸剪切强度 of the cured film reaches 5.71MPa, the peeling strength is 2.10kN•m- 1, 硬度 is 6H, the resistivity is reduced to to 5.30×10-2Ω•m. The test results variable temperature resistance test and the TG show that the conductive adhesive has