图文芯片封装方式大全要点分析.pdfVIP

各种IC 封装形式图片 QFP Quad Flat BGA Package Ball Grid Array TQFP 100L EBGA 680L SBGA LBGA 160L SC-70 5L PBGA 217L Plastic Ball Grid Array SDIP SIP SBGA 192L Single Inline Package SO Small TSBGA 680L Outline Package 1 CLCC SOJ 32L CNR Communication SOJ and SOP EIAJ Networking TYPE II 14L Riser Specification Revision 1.2 SOT220 CPGA SSOP 16L Ceramic Pin Grid Array DIP Dual Inline Package SSOP DIP-tab TO18 Dual Inline Package with Metal Heatsink 2 F