波峰焊和再流焊焊接技术(国外英语资料).doc

波峰焊和再流焊焊接技术(国外英语资料).doc

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波峰焊和再流焊焊接技术(国外英语资料)

波峰焊和再流焊焊接技术(国外英语资料) Welding equipment 2.3.1 reflow soldering equipment Reflow soldering equipment in the multifunctional intelligent development, mainly in the following aspects: (1) with multi nozzle unique control of reflow reflow furnace in order to control the welding temperature field in the furnace, in order to achieve better effect of new world Kazakhstan, ERSA reflow furnace multi nozzle unique airflow installed in the furnace control device, the furnace is uniformly distributed with a plurality of small nozzle, hot air flow through the nozzle, the formation of micro circulation in the surrounding area, to provide the optimal temperature distribution is adopted in the equipment area The domain separation system, each area of flow velocity in the flow direction of air volume and air temperature by special software control, to achieve the overall effect of hot air forced convection (2) reflow furnace reflow furnace welding area in the furnace bottom or cold reflow with local forced cooling is the upper region of increased force the cooling device, using piecewise control beam cooling speed of the reflow zone at the bottom of forced cooling is to ensure the effect of double SMT reflow soldering, reflow soldering to double SMT PCB, with more than 30 of the difference in both sides of the reflow zone plate, in order to optimize the process; forced a fast cooling device for cooling zone increase, ensure good welding of the SMT board by reflow curve optimization (3) can be reflow furnace of BTU company in the United States a new reflow furnace adopts the adaptive intelligent reflow temperature monitoring device Technology (AIRT), the reflow furnace in the reflow temperature change monitoring PCB components welding process, the actual temperature of the furnace temperature intelligent temperature camera it only measures the user PCB in each of the selected points on the supervisory board of the components on the solder paste, identify the temperature changes, and t

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